Details:

Grinding wheel for bevel machining of semiconductor material substrates. 

Notch machining wheels are available in three types: single-groove, multi-groove, and composite rough finishing.

Features

Even and ne diamond layer minimizes processing damage. 
Wear resistant bond with a high grain holding force is used to achieve high shap eretention and a long life. 
Highly precise slotted shape and nishing technology support various wafer shapes. 
Copper-less supported.